Sign in
|
English
|
Terms of Use
Dictionary
Forum
Contacts
Russian
⇄
English
G
o
o
g
l
e
|
Forvo
|
+
переходные отверстия в кремнии
stresses
microel.
Through Silicon Vias
(см.
статью through-silicon via в Мультитране
Varlog
)
;
Through-silicon VIA
(технология вертикальных межсоединений (Vertical Interconnect Access) при создании 3D-интегрированных структур. Известна как TSV
Godzilla
)
The server is undergoing maintenance and the site is working in read-only mode. Please check back later.">
Add
|
The server is undergoing maintenance and the site is working in read-only mode. Please check back later.">
Report an error
|
Get short URL
|
Language Selection Tips