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| distance between oscillation marks; oscillation mark pitch; oscillation mark spacing (Even under conditions of a non-varying casting speed and oscillation frequency, oscillation mark spacing increases as the level in mold rises and decreases as the level falls. 即使在拉坯速度和振频都不变化的条件下，振痕间距也会随着结晶器液位的升高而增大，结晶器液位的降低而减小。); pitch of oscillation marks; spacing of oscillation marks | |||
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