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Terms for subject Electronics containing 封装 | all forms | in specified order only
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三层金属四边引线扁平封装three metal quad flat package
三维超薄型小外廓封装three-dimensional ultra-thin small outline package
不封装的unencapsulated
专用封装application specific package
二极管扁平封装diode flat package
亚利桑那大学封装设计与模拟环境软件University of Arizona packaging design and simulation environment software
交错排列网格插针阵列封装staggered pin grid array package
优质半导体公司小外廓封装QSI small outline package
优质半导体公司甚小外廓封装QSI very small outline package
传输中性封装格式transport neutral encapsulation format
低架体四边引线扁平封装low-profile quad flat package
低架体四边引线扁平封装low-mount quad flat pack
保护环四边引线扁平封装guard-ring quad flat pack (age)
倒装片封装flip chip in a package
倒装芯片封装flip chip package
先进专用封装advanced specific package
全密封封装hermetic package
全封闭型装置totally enclosed apparatus
公制标准四边引线扁平封装外引线节距分别为1.0,0.8,0.65mmmetric quad flat pack age
公制塑料四边引线扁平封装metric plastic quad flat package
内置氮化铝散热器式塑料四边引线扁平封装plastic quad flat package with an internal aluminum nitride heat spreader
减薄缩小型小外廓封装thin shrink small outline package
减薄缩小型小外廓封装thin scaled small outline package
利用已封装绝缘体基硅集成光学元件的客户接人系统customer access systems utilizing packaged silicon-on-insulator integrated optical components
功率集成电路小外廓封装power small outline package
功率集成电路缩小型小外廓封装power shrink small outline package
功率扁平封装power flat package
半导体封装股份有限公司瑞士Semiconductor Packaging SA
单封装系统将信息获取、处理、驱动执行这三个小系统集成在同一封壳之内system on a package
单列插针式封装single in-line pin package
单列直插式塑料封装single in-line plastic package
单片封装式多功能阵列multifunctional array in monolithic package
单芯片封装single chip package
印制电路板基封装芯片sealed chip on board
印制电路板基带散热片塑料四边引线扁平封装printed circuit board-based plastic quad flat package with a heat slug
压力容器封头安装导杆vessel head installation guide
厚型四边引线扁平封装high-profile quad flat package
双列直插式封装外壳dual in-line case
双列直插式封装激光二极管dual-in-line packaged laser diode
双列直插式封装激光器dual in-line packaged laser
双列直插式封装逻辑dual in-line package logic
双芯片薄型小外廓封装dual die thin small outline package
双载带封装dual tape carrier package
叠层封装laminated package
叠层式芯片尺度封装stacked chip size package
叠片封装stacked chips package
可控熔塌高度芯片连接球栅阵列封装controlled collapse chip connection ball grid array package
可控熔塌高度芯片连接网格焊球阵列封装controlled collapse chip connection ball grid array package
可控熔塌高度芯片连接/陶瓷球栅阵列封装controlled collapse chip connection/ceramic ball grid array package
可控熔塌高度芯片连接/陶瓷网格焊球阵列封装controlled collapse chip connection/ceramic ball grid array package
可控阻抗封装controlled impedance package
四分之一缩比小外廓封装quarter-sized small outline package
四列直插式封装quadruple inline package
四列直插式封装quad in-line package
四边 J 形引线扁平封装quad flat J-leaded package
四边引线小外廓封装small output quad package
四边引线扁平封装quad flat package
四边引线载带封装quad tape-carrier package
四边引线载带封装quad tape carrier package
国际封装战略研讨会International Packaging Strategy Symposium
国际倒装片、网格焊球阵列、载带自动键合及先进封装技术研讨会International Flip Chip, BGA, TAB and advanced Packaging Symposium
国际电子封装与生产会议International Electronic Packaging and Production Conference
国际电子封装会议International Electronic Packaging Conference
国际电子封装协会International Electronics Packaging Society
国际装配与封装标准工艺线会议International Assembly and Packaging Foundry Conference
圆片级封装wafer level package
圆片级芯片尺度封装wafer-level chip size package
垂直双列直插式封装vertical dual in-line package
塑料双列直插式封装plastic dual-in-line package
塑料叠层封装plastic laminate package
塑料四边引线扁平封装plastic quad flat package
塑料小外廓封装plastic small outline (package)
塑料扁平封装flat plastic package
塑料球栅陈列封装plastic ball grid array package
塑料网格插针阵列封装plastic pin grid array package
塑料网格焊球阵列封装plastic ball grid array package
塑料芯片封装chip hermeticity in plastics
塑料芯片封装chip hermeticity in plastic
塑料针栅阵列封装plastic pin grid array package
外露铜散热片式塑料四边引线扁平封装plastic quad flat package with an exposed copper heat slug
多列直插式封装multiple in-line package
多层封装multilayer package
多层封装laminated package
多层模压塑料四边引线扁平封装multi-layer molded plastic quad flat package
多层陶瓷封装multilayer ceramic package
多层陶瓷框架封装multilayer ceramic frame package
多芯片封装multichip package
多芯片封装multi-chip in package
多芯片叠层封装stacked chips package
密封装置seal installation
密封装置airproof package
密封装置sealing device
密封装置enclosed installation
密封装置"nC"sealed device "nC"
密封包装airproof package
密封外壳装置canning machine
密封式电气装置hermetically sealed electrical device
封装二极管pack diode
封装化合物sealing compound
封装器encapsulator
封装安全净负荷encapsulating security payload
封装安全协议encapsulated security protocol
封装密室sealed-in cell
封装工艺测试承载芯片package process test vehicle (chip)
封装式电子电路packaged electronic circuit
封装引线housing lead
封装材料potting material
封装桥接方式encapsulation bridging
封装源packaged source
封装燃料元件packing fuel
封装的页面描述语言文件encapsulated postscript file
燃料组件封装站核canning station
封装级老化package level burn-in
封装阳极packaged anode
封装阻容组件RC-assembly
封闭入机架安装enclosed rack mounting
封闭式断路装置"nC"enclosed-break device "nC"
封闭式装置enclosed installation
封闭式装置enclosed assembly
小型封装mini package
小型封装微波集成电路mini-package microwave integrated circuit
小型交错排线直插式封装small zigzag in-line package
小型单芯片封装compact single chip package
小型扁平封装mini flat package
小型树脂封■装small resin package
小外廓封装small outline package
小外廓晶体管封装small outline transistor package
小方形封装mini-square package
少数芯片封装few chip package
嵌置引线塑料封装plastic embedded lead package
带式载体封装tape carrier package
带散热器的 J 形引线小外廓封装small outline J-leaded package with heat sink
带散热器的四边引线扁平封装quad flat package with heat sink
带散热器的小外廓封装heat sink small outline package
带散热器的缩小型四边引线扁平封装heat sink shrink quad flat pack (age)
带散热片的双列直插式封装finned dual in-line package
带缓冲减震层的四边引线扁平封装quad flat package with buffer
带缓冲减震层的四边引线扁平封装bumper quad flat package
带金属散热器单列直插式封装single in-line package with metal heat sink
带金属散热器的双列直插式封装组件dual in-line package with metal heatsink
带金属散热器的四列直插式封装quad in-line package with metal heatsink
带金属散热器的锯齿形排线直插式封装zigzag in-line package with metal heat sink
常规封装conventional package
底部引线塑料封装bottom leaded plastic package
放射性废物封装核waste encapsulation
J 形引线双列直插式封装dual in-line package with J leads
J 形引线小外廓封装small outline J-leaded package
I 形引线小外廓封装small outline I-leaded package
L 形引线小外廓封装small outline L-leaded package
C 形引线小外廓封装small outline C-leaded package
L 形引线扁平封装flat package L leads
J 形引线薄型小外廓封装thin, small outline J-lead package
微型网格焊球阵列封装micro ball grid array package
扁平封装二极管flat packaged diode
扁平封装晶闸管flat-packed thyristor
扁平封装闸流晶体管flat-packed thyristor
扁平塑料封装flat plastic package
放射性废物封装贮存设施核waste encapsulation and storage facility
散热封装heat-sinking package
新型封装芯片阵列组件chip array module in new package
方形扁平封装quad flat package
方形载带封装quad tape-carrier package
方形载带封装quad tape carrier package
无引线封装leadless package
无引线封装集成器件packaged leadless integrated device
无引线小外廓封装small outline non-leaded package
无引线方形扁平封装quad flat non-leaded package
无引线方形扁平封装quad flat leadless package
无引线气密封装leadless hermetic package
无法兰封装flangeless package
晶体管外形封装transistor outline package
最大封装密度maximum package density
有引线芯片载体封装lead chip carrier package
有源封装技术active packaging technology
有源网络封装协议active network encapsulation protocol
未封装的unencapsulated
极小型封装extremely small package
标准封装晶体振荡器standard packaged crystal oscillator
标准电子封装standard electronic package
核燃料元件外壳封装机核fuel element canning machine
梁式引线互连封装beam-lead interconnected packaging
模压载体环四边引线扁平封装molded carrier ring quad flat pack
模塑小型封装compact mini-package
模拟系统组件封装analog system assembly pack
气密封装hermetically sealed package
氮气密封装置nitrogen gas seal equipment
油密封装置oil sealing gland
浇封装置"nC"encapsulated device "nC"
测试、装配与封装test, assembly and packaging
混合电子电路轻型封装hybrid electronic lightweight package
源的封装核source capsule
热增强封装thermally enhanced package
塑料热增强四边引线扁平封装plastic thermally enhanced quad flat package
焊台区阵列封装pad area array package
玻璃密封陶瓷双列直插式封装组件glass-sealed dual in-line package
玻璃封接陶瓷四边引线扁平封装glass sealed ceramic quad flat package
甚小外廓封装very small outline package
甚窄引线节距四边引线扁平封装very fine-pitch quad flat package
甚细长载带封装super slim TCP
甚薄型四边引线扁平封装very-thin quad flat pack
电子封装与生产杂志Electronic Packaging & Production
电子元件封装用玻璃-硅酮-玻璃叠层glass-silicone-glass laminate for electronic component package
电子电路互连与封装协会Institute for Interconnecting and Packaging Electronic Circuits
电极密封装置electrode gland
电路封装circuit package
窄引线节距封装fine pitch package
窄引线节距四边引线扁平封装fine pitch quad flat package
窄节距四边引线扁平封装外引线节距分别为0.5、0.4、0.3mmfine-pitch quad flat package
立式封装组件vertical package module
管脚直插式封装pin-in-line package
纸薄封装又称UTP,外廓厚度0.5mm 的薄型封装paper-thin package
纸薄型四边引线扁平封装paper-thin qual flat package
组件封装functional packaging
细节距封装技术fine pitch technology
绝缘晶体管外形封装isolated transistor outline package
缩小型双列直插式封装shrink dual in-line package
缩小型四边引线扁平封装shrink quad flat pack (age)
缩小型小外廓封装shrunk small outline package
缩小型小外廓封装shrink small outline package
缩小型小外廓封装集成电路shrink small outline package integrated circuit
耐热性增强封装thermally enhanced package
背负式封装piggyback package
自焊式四边引线扁平封装self solder quad flat package
芯片尺度封装其封壳周长等于或小于所含裸芯片周长的 1.2 倍chip size package
芯片尺度封装其封壳周长等于或小于所含裸芯片周长的 1.2 倍chip scale package
芯片级封装chip size package
芯片级封装chip scale package
芯片级薄型封装chip scale thin package
芯片规模封装国际会议International Conference on Chip-scale Packaging
英特尔小型封装Intel mini-pack
薄型双列直插式封装skinny dual in-line package
薄型四边引线扁平封装thin quad flat package
薄型四边引线扁平封装low-mount quad flat pack
薄型四边引线扁平封装low-profile quad flat package
薄型塑料四边引线扁平封装low-profile plastic quad flat package
薄型小外廓封装thin small outline package
薄型甚小外廓封装thin very small outline package
薄外廓封装thin outline package
装人存储器封锁寄存器load memory lockout register
装配、封装与试测assembly, packaging and test
装配与封装assembly and packaging
计算机辅助微电子封装设计computer aided design of microelectronic package
负载密封固定装置loadlock
超小型树脂封装extremely small resin package
超小外廓封装ultra small outline package
超小外廓封装mini small outline package
超级网格焊球阵列封装一种热增强 BGA 封装super ball grid array package
超细长载带封装ultra slim TCP
超细长载带封装液晶显示器ultra-slim TCP liquid crystal display
超薄型封装又称PTPultrathin package
超薄型双列直插式封装skinny dual in-line package
超薄型四边引线扁平封装ultrathin quad flat pack
超薄型小外廓封装ultra-thin small outline package
超薄型小外廓封装super thin small outline package
超薄无引线封装ultra-thin leadless package
超薄无引线小外廓封装ultrathin small outline no-lead package
载带封装tape carrier package
载带四边引线扁平封装tape quad flat package
载带自动键合模压封装tab-molded package
适当规模封装right scale package
通用路由封装协议generic routing encapsulation protocol
金属四边引线扁平封装metal quad flat package
金属方形封装metal quad package
金属网格焊球阵列封装metal ball grid array package
金属陶瓷封装metal ceramic package
钮扣型封装Swiss outline package
钮扣型封装集成电路Swiss outline integrated circuit
锯齿形排线直插式封装zigzag in-line package
长条型双列直插式封装slender dual in-line package
陶瓷双列直插式封装组件ceramic dual in-line package
陶瓷双列直插式封装ceramic dual-in-line package
陶瓷四边引线扁平封装ceramic quad flat pack (age)
陶瓷小外廓 J 形引线封装ceramic small-outline J-lead package
陶瓷扁平封装ceramic-flat package
陶瓷扁平封装ceramic flat package
陶瓷方形封装ceramic quad package
陶瓷气密封装ceramic hermetic package
陶瓷球栅阵列封装ceramic ball grid array package
陶瓷网格焊球阵列封装ceramic ball grid array package
集成封装与组装公司美国Integrated Packaging & Assembly Corp.
集成电路封装检测integrated circuit package inspection
面向应用的封装选择application-oriented package selection
面阵列封装area array package
高密度封装high density package
高密度四边引线扁平封装high density quad flat package
高密度塑料四边引线扁平封装high-density plastic quad flat package
高级小外廓封装quality small outline package

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