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| copper mold plate thickness (【技】选取结晶器铜板厚度时应考虑到的相关因素有：铜板材质对加工应力和热应力的抵抗能力、结晶器的结构形式、冷却水量大小和分布、电镀层厚度以及浇注操作等。) | |||
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