Sign in
|
English
|
Terms of Use
Dictionary
Forum
Contacts
Chinese
⇄
English
Terms
for subject
Electronics
containing
装 键
|
all forms
Chinese
English
倒装芯片微米级焊台键合技术
flip chip micron bump bonding
倒装芯片焊剂焊台键合
flip chip solder bump bonding
倒装芯片键合技术
flip chip bonding
国际倒装片、网格焊球阵列、载带自动键合及先进封装技术研讨会
International Flip Chip, BGA, TAB and advanced Packaging Symposium
截流装置键
cut-off key
按键装置
push-button unit
移幅键控红外装置
amplitude shift keyed infrared
载带自动键合模压封装
tab-molded package
键合、装配与测试
环境
bond, assembly and test
environment
Get short URL
