装焊 – phrases

Terms for subject Electronics containing 装焊 | all forms | in specified order only

Chinese	English
倒装焊接法	face-down bonding
倒装芯片塑料网格焊球阵列	flip chip plastic ball grid array
倒装芯片微米级焊台键合技术	flip chip micron bump bonding
倒装芯片焊剂焊台键合	flip chip solder bump bonding
倒装芯片网格焊球阵列	flip chip ball grid array
可控熔塌高度芯片连接网格焊球阵列封装	controlled collapse chip connection ball grid array package
可控熔塌高度芯片连接/陶瓷网格焊球阵列封装	controlled collapse chip connection/ceramic ball grid array package
国际倒装片、网格焊球阵列、载带自动键合及先进封装技术研讨会	International Flip Chip, BGA, TAB and advanced Packaging Symposium
塑料网格焊球阵列封装	plastic ball grid array package
套装焊条	nested electrode
安装焊接	erection welder
微型网格焊球阵列封装	micro ball grid array package
旋转式电子束焊接装置	carousel electron beam welding jig
晶体管装架焊点	transistor mounting pad
焊台区阵列封装	pad area array package
自动电弧焊装置头	automatic arc welding head
自焊式四边引线扁平封装	self solder quad flat package
表面安装与回流焊技术会议	Surface Mounting and Reflow Technology Conference
超级网格焊球阵列封装一种热增强 BGA 封装	super ball grid array package
金属网格焊球阵列封装	metal ball grid array package
陶瓷网格焊球阵列封装	ceramic ball grid array package