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Terms for subject Electronics containing 层合 | all forms | in specified order only
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下层集合体next level aggregator
专用链路层上的综合业务integrated services over specific link layer
位置层集合体site level aggregator
保护臭氧层工业合作组织Industry Cooperative for Ozone Layer Protection
先进单层多晶硅射极耦合技术由标准 ABiC 工艺简化而来的一种双极工艺advanced single polysilicon emitter coupled technology
具有三种涂层的复合包覆颗粒【核】triplex coated particle
层合成高压隔离laminated synthetic high voltage isolation
受主型石墨夹层化合物graphite intercalation compound of acceptor type
因科镰尔合金反射层【核】Inconel reflector
层合成微细结构反射镜layered synthetic microstructure mirror
多层氧化铝-二氧化硅组合multilayer aluminium oxide-silicon dioxide combination
多层混合集成电路multilayer hybrid integrated circuit
多层混合集成电路multilayer hybrid circuit
多层混合集成电路器件multilayer hybrid circuit device
多层组合绝缘multilayer composite insulation
多层过渡金属双硫属化合物layered transition metal dichalcogenide
密式结合层close binder
并合外延层横向过生长merged epitaxial lateral overgrowth
整合涂层conformal coating
施主型石墨夹层化合物graphite intercalation compound of donor type
最高层集合体top level aggregator
消耗臭氧层化合物ozone depleting compound
燃料-包壳结合层【核】fuel cladding bond
石墨夹层化合物graphite intercalation compound
石墨氟夹层化合物graphite fluorine intercalation compound
石棉-清漆复合绝缘asbest-varnish compound
硬质合金堆焊层weld deposited cladding
空松结合层open binder
粘合层厚度bond line thickness
结合层connection layer
综合业务数字网控制子层ISDN control sublayer
网站层集合体site level aggregator
聚合物绝缘高密度多层混合集成电路high density multilayer hybrid integrated circuits with polymer insulating layers