Sign in | English | Terms of Use
DictionaryForumContacts

   Chinese ⇄
Terms for subject Information technology containing 封 | all forms
ChineseEnglish
两段封锁法two phase locking
中断封锁时间interrupt lockout time
中断开放和中断封锁interrupt enable and interrupt disable
交付包封delivery envelope
低压密封式空气断路器开关装置low voltage enclosed air circuit breaker switchgear
低厚度四侧引脚扁平封装low-profile quad flat package
公制四侧扁平封装metric quad flat package
写入封锁write lockout
出错封锁error lock
单列直插式封装single in-line package
单列针式直插式封装single in-line pin package
单层金属化封装single layer metallization package
印刷封锁禁止打印指令print suppression
"印刷封锁"指令"print suppression"
双侧引脚带载封装dual tape carrier package
双侧引脚扁平封装dual flat package
双列直插式封装dual in-line package
双列直插式封装dual inline package
双列直插式陶瓷封装dual in-line ceramic package
四侧 I 形引脚扁平封装quad flat I-leaded package
四侧 J 形引脚扁平封装quad flat J-leaded package
四侧 J 形引脚扁平封装quad J-leaded flat package
四侧 I 形引脚扁平封装quad I-leaded flat package
四侧小引脚扁平封装fine-pitch quad flat package
四侧引脚厚体扁平封装quad flat high package
四侧引脚带载封装quad tape carrier package
四侧引脚扁平封装quad flat package
四侧无引脚扁平封装quad flat non-leaded package
四侧无引脚扁平封装quad non-leaded flat package
四列直插封装quad-in-line package
四列直插封装quad in-line package
块封锁状态block lock state
基于封锁的并发控制concurrency control by locking
塑封球栅阵列plastic ball grid array
塑料扁平封装plastic flat package
塑料方型扁平式封装plastic quad flat package
密封晶体单元hermetically sealed crystal unit
密封继电器hermetically sealed relay
对象封装object encapsulation
对象封装法object wrapper
对象内容封装object content envelope
封装组装,装配密度packaging density
封装安全净负荷encapsulating security payload
IP封装安全载荷IP encapsulating security payload
封装桥接器packaging bridge
GPON 封装模式GPON encapsulation method
封装的 PostScriptencapsulated PostScript
封装的 PostScript 文件encapsulated PostScript EPS file
封装类型encapsulated type
封装网桥encapsulation bridging
封装软件canned software
Winl6Lock 封锁体Winl6Lock
封锁协议locking protocol
封锁卷locked volume
封锁域字段locked field
封锁换码字符locking-shift character
封锁机制lock-out facility
封锁的文件locked file
封锁的键盘locked keyboard
封锁粒度lock granularity
封锁/释放功能lock/unlock facility
封闭锁lock out
封闭性问题closed question
封闭数组closed array
封闭特性closed property
封闭结构closed architecture
小型球栅阵列封装tiny BGA (ball grid array)
小型球栅阵列封装tiny ball-grid-array (Tiny BGA)
小外形封装small outline package
小形扁平封装multi flat package
带出网通路的双边封闭用户组bilateral closed user group with outgoing access
带引脚的陶瓷芯片封装ceramic leaded chip carrier
带引脚的陶瓷芯片封装ceramic leaded-chip carrier
带缓冲垫的四侧引脚扁平封装quad flat package with bumper
平面栅格阵列封装land grid array
Z 形双列直插式封装ceramic zigzag in-line package
Z 形双列直插式封装CerZIP ceramic zigzag in-line package 陶瓷
Z 形直插式封装zigzag in-line package
微型球栅阵列封装micro ball grid array package
微电子封装microelectronic packaging
总线封锁bus lock
扁平封装flat package
挂起封锁suspend lock
数据封装digital envelop
数据封装data encapsulation
树封锁协议tree protocol
注释封行禁止comment out
球栅阵列封装ball grid array
磁盘封锁disk locking
窄体双列直插式封装skinny dual in-line package
系统封装system package
线路封锁line lock
腔体塑封球栅阵列cavity plastic ball grid array
芯片上引线封装lead on chip
芯片尺寸封装chip size package
芯片级封装chip scale packaging
薄型四方扁平封装thin quad flat package
薄型小尺寸封装thin small outline package
薄膜封装tape carrier package
表面黏贴式封装技术surface mounted technology
表面黏贴式封装技术surface mounting technology
警告封锁协议warning looking protocol
起停包封start-stop envelop
通用路由封装generic routing encapsulation
陶瓷双列直插式封装CerDIP (ceramic dual in-line package)
陶瓷双列直插式封装ceramic dual in-line package
陶瓷四边引线扁平封装ceramic quad flat package
陶瓷Z形双列直插式封装ceramic zigzag in-line package (CZIP, CerZIP)
集成电路封装integrated circuit package
集成电路芯片封装IC chip package

Get short URL